Top skills you will learn:Participants will develop the ability to interpret yield data, identify defect trends, and conduct systematic failure analysis in semiconductor devices. They will learn how to apply reliability testing methods, diagnose device-level failures, and implement corrective actions that enhance product reliability and manufacturing yield.

Top skills you will learn:Participants will be able to build and integrate Python-based Robot Framework automation for functional, integration, and regression testing, enhance test coverage for embedded and connected systems, and incorporate automation into quality pipelines to improve product reliability and speed to market.

Top skills you will learn:Participants will gain the ability to manage engineering operations using PLM systems, control CAD and BOM integrity, execute structured change management, align design with manufacturing and suppliers, and drive NPI execution with reduced risk and faster time-to-market.