Top skills you will learn:Participants will develop the ability to interpret yield data, identify defect trends, and conduct systematic failure analysis in semiconductor devices. They will learn how to apply reliability testing methods, diagnose device-level failures, and implement corrective actions that enhance product reliability and manufacturing yield.

Top skills you will learn:Participants will gain the ability to evaluate supplier technical and quality capabilities, assess manufacturing readiness, conduct structured audits, manage supply risk, and make procurement decisions aligned with engineering, cost, and delivery objectives.

Top skills you will learn:Participants will gain the ability to manage engineering operations using PLM systems, control CAD and BOM integrity, execute structured change management, align design with manufacturing and suppliers, and drive NPI execution with reduced risk and faster time-to-market.